Xiaomi has once again taken an important step in the field of self-developed chips. Recently, Xiaomi Group President Lu Weibing personally confirmed in a live broadcast that XRING chip will launch new iterative products this year, and it is “very powerful.” Flagship products equipped with this new chip will be launched soon. This speech not only injects new momentum into Xiaomi’s self-developed chip camp, but also makes the outside world full of expectations for the performance specifications of the next generation “Xuan Ring O3” (XRING O3).
XRING O1: Xiaomi’s masterpiece after ten years of hard work
When talking about XRING chips, we have to review Xiaomi’s arduous journey on the road of self-research of chips. In May 2025, Xiaomi officially launched the annual flagship mobile phone Xiaomi 15S Pro, which was first equipped with the first-generationXRING O1 chip. This is the first time in ten years that Xiaomi has made a substantial breakthrough in the field of high-end mobile phone chips. It is also the first company in China and the fourth company in the world to independently develop 3nm mobile phone chips.
According to Xiaomi CEO Lei Jun at the Investor Day event, XRING O1 chip shipments have exceeded 1 million since its launch and are used in three devices, namely Xiaomi 15S Pro, Pad 7 Ultra and Pad 7S Pro.
“Achieving this milestone requires immense dedication, courage, and a large amount of technical and financial resources. XRING O1 is just the starting point for us to redefine the capabilities of high-end semiconductors in the global market.” Lei Jun said at the time.
New chips are coming out this year: performance reaches new highs and applications span across categories
Regarding the next-generation XRING chip that the market is most concerned about, Lu Weibing said cryptically in the live broadcast: “It is not convenient to disclose the specific details of the new XRING chip at this stage. The credibility of various related rumors currently circulating on the Internet is not high. You can wait for the follow-up official announcement. The final product experience is worth looking forward to.”
However, according to currently known information, the new generation of XRING chips may be codenamed “XRING O3” and will use TSMC’s most advanced 3nm process. Its core performance will reach a new high compared to the first generation.
What is even more noteworthy is that the application scope of this new chip will no longer be limited to a single category of smartphones. It will be widely installed on Xiaomi’s various smart terminal devices with different positionings, including smartphones, tablets, smart bracelets, smart watches, and even electric vehicles. This cross-category application layout can further expand the ecological application scenarios of self-developed chips and greatly enhance the smart use experience of full-scenario interconnection.
Ecological integration strategy: open up the underlying architecture and realize the interconnection of everything
Xiaomi’s layout in the semiconductor field has never been just for the “chip” itself. By opening up the underlying architecture of all categories of devices, Xiaomi is expected to achieve deeper cross-device collaboration, make the interconnection between different devices more smooth and natural, and provide users with a unified experience of all-scenario ecological services.
Industry analysts pointed out that Xiaomi’s entry into the highly competitive chip industry highlights its determination to seek growth through innovative and differentiated products. As the global smartphone market becomes increasingly saturated, Xiaomi’s self-developed chip capabilities will become Xiaomi’s core weapon in competing with giants such as Apple and Samsung in the high-end market.
Outlook: When will XRING O3 be unveiled?
Lu Weibing’s preview made the outside world full of expectations for XRING’s new chip. Although the official is tight-lipped at this stage, there are various signs that this new product is under active preparation. The industry speculates that the new chip may be paired with Xiaomi’s next-generation flagship mobile phone Xiaomi 15 Ultra or the upgraded version of Xiaomi 15S Pro. It will be officially released at the end of this year or early next year at the earliest. It is unknown whether products equipped with this chip will also be sold in countries other than China.
Source: KOCPC Chinese