At Xiaomi’s XRING chip technology briefing this afternoon (August 24), the company unveiled three self-developed chips at once: the XRING O3 smartphone SoC, the XRING O100 AI accelerator chip, and the XRING D100 autonomous driving chip. Among them, the XRING O3 scored 5.228 million on AnTuTu, making it the first flagship SoC to break the 5 million mark, officially bringing Xiaomi’s self-developed chips into direct competition with Qualcomm and Apple. The XRING O3 has entered mass production and will debut in the Xiaomi 18 Fold folding flagship and the Xiaomi Pad 9 Pro Max, with an official launch expected in September.
XRING O3: 10-core all-big-core architecture, world’s first with LPDDR6
The XRING O3 uses TSMC’s 3nm (N3P) process, with a die area of 133mm² and a transistor count of 24 billion, a 26% increase in scale over the previous generation.
The CPU section uses a ten-core all-big-core design, comprising 2 C1-Ultra super-large cores, 4 C1-Premium large cores, and 4 C1-Pro mid cores, with a maximum clock speed of 4.35GHz. In GeekBench 6.5 benchmarks, it scores 3,945 points in single-core and exceeds 15,000 points in multi-core, representing improvements of 31% and 60% respectively over the previous generation.
The GPU debuts with a 16-core G2-Ultra NX graphics processor, delivering an 85% boost in graphics performance over the previous generation while cutting power consumption by 64%. This GPU upgrade is generational in scope — the naming alone shows Xiaomi’s positioning for this chip. On the memory side, the XRING O3 is the world’s first mobile processor to support LPDDR6, with bandwidth reaching 113.8GB/s — a 48% improvement over LPDDR5X — while remaining backward compatible with LPDDR5X.
In terms of AI computing power, it features a built-in 4-core low-power NPU, delivering up to 200 TOPS of tensor compute and 3.13 TFLOPS of vector compute, specifically optimized for on-device large model inference. It also comes with a fifth-generation ISP, with image processing capabilities upgraded accordingly.
Benchmark Showdown: First to Break 5 Million, Catching Up with Qualcomm and Apple
In the AnTuTu V11 real-world benchmark, the XRING O3 scored 5.228 million points, making it the first flagship SoC in the Android camp to break the 5-million mark. Compared with its competitors, the XRING O3’s performance is close to that of Qualcomm’s Snapdragon 8 Elite Gen 5. According to previously leaked comparison data, the gap between the two in total AnTuTu scores is within 100,000 points, which translates to a difference of less than 2%. In GeekBench multi-core testing, the XRING O3’s score of over 15,000 even surpasses that of Apple’s A19 Pro.
However, it should be noted that Qualcomm’s next-generation Snapdragon 8 Elite Gen 6 Pro and MediaTek’s Dimensity 9600 Pro will both adopt a more advanced process, with clock speeds expected to exceed 5GHz. The XRING O3 is currently benchmarked against this generation’s flagship chips, not the next generation. Still, reaching this level with a second-generation self-developed chip already far exceeds external expectations for Xiaomi’s chip-making progress.
XRINGO100: Industry’s First 6nm 3D-Stacked AI Accelerator Chip
XRING O100 is Xiaomi’s first high-bandwidth AI accelerator chip designed specifically for on-device large models, using 6nm wafer-level vertical stacking (Wafer-Level 3D Stacking) packaging technology to achieve an industry-leading 1.4-micron bonding pitch.
The core specification of this chip is an ultra-high memory bandwidth of 1.22TB/s, which is 16 times that of traditional flagship phones. Through the Face-to-Face metal-layer direct connection architecture, the transmission distance between DRAM and the logic chip is greatly shortened. On-device inference speed can reach up to 330 TPS, and overall AI performance is 10 times higher than that of traditional solutions.
The XRING O100 is positioned as a coprocessor for SoCs, specifically designed to address the bandwidth bottleneck of on-device large models. It has completed R&D and is expected to enter commercial use next year.
XRING D100: China’s first 3nm high-compute AI chip for intelligent driving
XRING D100 is China’s first 3nm autonomous driving AI chip with high computing power, integrating a 20-core high-performance CPU and a 16-core high-computing-power NPU. It supports up to 160GB of unified memory, enabling local deployment of ultra-large models with 200B parameters.
This chip is aimed at Xiaomi’s autonomous driving needs. Based on the specs, 160GB of unified memory plus the ability to deploy a 200B model locally shows that Xiaomi has significant ambitions in the intelligent driving space, aiming to bring cloud-level AI inference capabilities to the vehicle. The XRING D100 has also completed development and is expected to enter commercial use in 2027.
Launch Devices and Release Schedule
Xiaomi announced its new product configuration plans at the briefing:
- Xiaomi 18 FoldFolding flagship, global debut featuring the XRING O3 chip, officially launching in September. The previous generation MIX Fold 4 had a starting price of RMB 8,999 (approximately NT$40,500). Due to the higher cost of the XRING O3 chip and storage price increases, the Xiaomi 18 Fold’s starting price is expected to break through the RMB 10,000 mark.
- Xiaomi Pad 9 Pro MaxAlso comes with the XRING O3, and will also be released in September.
- Mystic Ring O100：AI加速協處理器，明年商用
- XRING D100: Autonomous driving chip, to be commercially deployed in 2027
Xiaomi’s Next Step in Chip Manufacturing
From the failure of the Surge S1 in 2017, to the return of the XRING O1 in 2025, and now the simultaneous unveiling of three chips today, Xiaomi has spent nearly a decade on the road to self-developed silicon. The performance data of the XRING O3 proves that Xiaomi has the ability to design flagship SoCs on par with Qualcomm and MediaTek, while the O100 and D100 showcase a chip portfolio spanning everything from phones to automobiles.
For Taiwanese consumers, the most immediate impact is the Xiaomi 18 Fold, arriving in September. This foldable flagship will be the first product to feature the XRING O3, and a key test of how Xiaomi’s self-developed chip performs in real-world usage. From chip design to final product launch, Xiaomi is building a complete self-developed chip ecosystem spanning phones, tablets, and cars—a move that is unique among Chinese tech companies.